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NYP and Cranfield join hands to develop advanced ICT for future factories

Kareyst Lin | Oct. 28, 2016
Partnership will also support development of talent for digital manufacturing age

Image credit: NYP

Singapore's tertiary education institution Nanyang Polytechnic (NYP) and United Kingdom's (UK) Cranfield University (CU) have entered a strategic collaboration to develop advanced information and communication technologies (ICT).

These technologies will be useful for the design and operation of factories of the future, NYP said in a press statement on 27 October 2016.

The partnership will also support the development of talent required for the digital manufacturing age for the two countries. NYP and CU will undertake joint Research and Development projects, and staff and student exchanges for a three-year period.

Under the collaboration, both organisations will develop mutual capabilities in areas such as digital manufacturing, cyber secure manufacturing and advanced informatics for autonomous manufacturing.

These areas enable intelligent and flexible production on the shopfloor and facilitate shopfloor to topfloor integration across the supply chain, in both physical and cyber realms. This improves product quality, productivity and profitability.   

"Through this collaboration, our students can benefit from being exposed to the latest digital technologies in the manufacturing industry as well as learn life skills from working alongside world-class faculty and students at Cranfield," said Lee Youn Kay, Director, School of Engineering, Nanyang Polytechnic.

This partnership follows a recent collaborative research project between NYP and CU on the digitisation of complex manufacturing processes using low-cost technologies from the world of gaming. 


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